National Central University Optical Sciences Center
 
 
Program of PAEU > Abstracts  
¡DOrigins and Purposes
¡DAbstracts
¡DThe Project Results
¡DProgram of PAEU (phase II)
¡DLinks
¡DAbstracts
The purposes of this project are the integrated system of the micro optoelectronic components such as the blue laser diode pick-up head, the know-how of the high frequency microwave and the optoelectronic element integrated circuits, and the advance techniques for the new trend in the next century. We hope that we can establish the fabrication techniques of the silicon wafer, the gallium arsenide high frequency devices, and the optoelectronic element. We integrate and make use of the specialties of the research teams in the national central university, in order complete a sophisticated project of crossing over several academic researches. Then we can upgrade to the level of the advanced countries for the research of the integrated micro optoelectronic system in our country, and we expect that we join in the international top research communities. This ¡§integrated micro-optoelectronics devices and systems¡¨ research project consists of 2 sub-projects:
1. The techniques of Micro-Optoelectronics
2. High frequency microwave and optoelectronic integrated circuit system
This interdisciplinary project will be executed by a research group containing 11 professors of different research domains. They come from institute of optical science, electrical engineering department, mechanical engineering department and physics department of National Central University We will also invite Pr. Ming C. Wu of UCLA and Pr. Ming Fon of university of Illinois as consultants.
The purpose of the first sub-project is to build the micro-optoelectronic technique. It is not only to build the micro-optical parts such as micromirror, microlens, and etc, but also to integrate them together to a system. In this project, the micro-optical bench and the next generation blue laser DVD pickup head will be developed.

This propose is to develop the micro-optical techniques, including:
(1) Manufacture technique for micro-optical parts.
(2) Wafer bonding or chip bonding, to put micro-optical parts bond together when building in different substrate.
(3) Integration technique to assemble the micro-optics parts into system.

The major task of the second sub-project is to explore the III-V compound semiconductor (GaAs, InP and GaN) based materials, devices (high-speed electronics and optoelectronics), and integrated circuit for modern communication system, which include wireless communication and optical fiber communication.
To establish the ability of 0.1£gm fabrication is the starting point for this whole project. Base on this 0.1£gm fabrication ability, the processing technique, design and integration for a high operation frequency (f>30GHz) integrated circuit will be developed. The development covers (1) RF transceiver based on III-V (GaAs and InP) compound semiconductor. (2) Silicon monolithic integrated circuit for RF application.
On the other hand, the development of optical fiber communication for 10Gbps includes the starting point of 0.1£gm fabrication ability, GaN-based quantum dot blue laser, III-V compound based drive circuits, photo-detector and amplifiers.
Since transistors invented in 1947 and the mature of integrated circuits technologies, modern electronic system has been approached to a new era of ¡§system-on-a-chip¡¨. Those two communication systems will finally be integrated on silicon substrate with other silicon based circuits (other projects) to achieve this concept: ¡§system-on-a-chip¡¨.

Copyright © 2004 Optical Sciences Center,National Central University. All Rights Reserved.